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CHR2411-QDG
RoHS COMPLIANT
22-24.5GHz RX Multifunction
GaAs Monolithic Microwave IC In QFN package
Description
The CHR2411 is a monolithic multifunction in K-Band which integrates a Low Noise Amplifier and a mixer providing an IF signal from DC to 1 MHz. All the active devices are self biased on chip. The circuit is manufactured with a standard GaAs HEMT process : 0.25m gate length, via holes through the substrate, air bridges and electron beam gate lithography. The chip is delivered in a 24 Leads RoHS compliant QFN4x4 package.
Main Features
n n n n n Typical Noise figure : 7 dB Stable gain vs temperature 23 2.5 dB Single supply Voltage: +5V Devices self biased on chip Standard SMD package : QFN 24L 4x4
Main Characteristics
Symbol RX_RF
Parameters Frequency range Conversion Gain SSB Noise figure (IF=1MHz)
Min 22 19
Typ
Max 24.5
Unit GHz dB dB dB
23 7
27
RX_LO / RX_RF
Input / Output Return Loss
8
15
ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions !
Ref. : DSCHR2411QDG6174 - 23 Jun 06 1/8 Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Departementale 128 - B.P.46 - 91401 Orsay Cedex France Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
K-band RX
CHR2411-QDG
Electrical Characteristics
Full temperature range
Symbol/Pins RX_RF RX_LO RX_IF RX_RF RX_LO RX_IF PLO Frequency range Frequency range Frequency range Return Loss Return Loss IF Load impedance LO Drive Power Conversion Gain Gain variation over Temperature SSB Noise figure (IF=1MHz) Input Power at 1 dB Gain Compression @24GHz Input IP3 @24GHz LO to RF Isolation +Vg, +Vd Top Supply Voltage Supply Current Operating temperature range(3) -40 0 19 Parameters Min 22 22 DC 8 8 15 15 50 5 23 2.5 7 -21 -12 -45 5 60 25 80 100 -30 Typ Max 24.5 24.5 1 Unit GHz GHz MHz dB dB Ohms dBm dB dB dB dBm dBm dB V mA C
Remark :
These performance has been obtained with the chip in QFN package mounted on the recommended boards (ref. 95541 & 95581) described in this document. These performance are highly dependent on this environment.
Absolute Maximum Ratings (1)
Symbol +Vg, +Vd +I PLO PRF Top Tstg Parameters Maximum pos itive supply voltage Maximum positive supply voltage Maximum peak input power overdrive Maximum peak input power overdrive Operating temperature range (2) Storage temperature range Values 6 90 8 -12 -40 to +100 -55 to +125 Unit V mA dBm dBm C C
(1) Operation of this device above anyone of these parameters may cause permanent damage. Duration < 1s (2) Temperature of the back side of the QFN. Thermal resistance RTh= 155C/W
Ref. : DSCHR2411QDG6174 - 23 Jun 06
2/8
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
K-band RX
CHR2411-QDG
Typical QFN measurements on board 95541 (QFN plan)
Conversion Gain vs Frequency PLO= 0dBm
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 22 22,5 23 23,5 24 24,5
Conversion Gain (dB)
-40C
25C 100C
25
25,5
26
Conversion gain vs RF Input Power PLO= 0dBm FLO=24.25GHz
30 29 28 27 26 -40C 25 24 23 25C 22 21 20 19 100C 18 17 16 15 -40 -38 -36 -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 RF Input power (dBm)
Ref. : DSCHR2411QDG6174 - 23 Jun 06
Conversion Gain (dB)
3/8
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
K-band RX
QFN Outline
CHR2411-QDG
Ref. : DSCHR2411QDG6174 - 23 Jun 06
4/8
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
K-band RX
CHR2411-QDG
QFN Pin-out description
Pin number 4 15 20 23, 22, 21, 10 9,11 3, 5, 7, 14, 16, 25 1, 2, 6, 8, 12, 13, 17, 18, 19, 24 Pin name RFIn LO FI D1, D2, D3, VD Buffer VGLna, VG Buffer GND Nc Symbol Name RX_IN RX_LO RX_IF +Vd +Vg RF Input port LO Input port IF Output port Positive Drain supply voltage Positive Gate supply voltage Ground Not connected Description
External Components and bias configuration (recommended)
19 18 17 16 15 14 13 12
20
21
22
23
24 1 2 3 4 5 6
11
10
9
8
7
Ref. : DSCHR2411QDG6174 - 23 Jun 06
5/8
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
K-band RX
CHR2411-QDG
Recommended Test Fixture (Ref. 95541) for measurements over Temperature Range
Decoupling capacitor
Remark :
-The label "RF OUT" printed out on this board corresponds to the LO Input Port. -10nF decoupling capacitors are used on DC biasing.
Ref. : DSCHR2411QDG6174 - 23 Jun 06
6/8
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
K-band RX
CHR2411-QDG
ESD sensitivity
Norm MIL-STD-1686C ESD STM5.1-1998 Value HBM Class 1 (<1000V) HBM Class 0 (<250V)
Package Information
Parameter Package body material Lead finish MSL Rating RoHS-compliant Low stress Injection Molded Plastic 100% matte Sn MSL1
Recommended surface mount package assembly (see UMS AN0017)
For volume production the SMD type package can be treated as a standard surface mount component (please refer to the IPC/JEDEC J -STD-020C standard or equivalent). The assembly on the motherboard can be performed using a standard assembly process (e.g. stencil solder printing, standard pick-and-place machinery, and solder reflow oven). However, caution should be taken to perform a good and reliable contact over the whole pad area.
MAXIMUM RECOMMENDED REFLOW PROFILE for LEADFREE SMT ASSEMBLY PRODUCTS
300 280 260 240 217 220 200 Temperature (C) 180 160 140 120 100 80 60 40 20 0 0 20 40 60 80 100 120 140 160 180 Time (s) 200 220 240 260 280 300 320 340 360 Maximum Ramp up rate : 3C / second 30s Max 150 255
Attention: The solder thickness after reflow should be typical 50m [2 mils] and the lateral alignment between the package and the motherboard should be within 50m [2 mils]. It is important for the performance of the product that the whole overlapping area between the motherboard and package pads is connected. Voids or other improper connections, in particular, between the ground pads on motherboard and package will lead to a deterioration of the RF performance and the heat dissipation. The latter effect can reduce drastically reliability and lifetime of the product.
Ref. : DSCHR2411QDG6174 - 23 Jun 06
7/8
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
K-band RX
CHR2411-QDG
Ordering Information
24L-QFN4x4 Lead Free Package :
Stick: XY=20 Tape and reel: XY=21
CHR2411-QDG/XY
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S.
Ref. : DSCHR2411QDG6174 - 23 Jun 06
8/8
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

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